Through silicon via filling technologies in superconducting quantum

ZHENG Weiwen, LUAN Tian, ZHANG Xiang

Science & Technology Review ›› 2024, Vol. 42 ›› Issue (2) : 50-57.

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Science & Technology Review ›› 2024, Vol. 42 ›› Issue (2) : 50-57. DOI: 10.3981/j.issn.1000-7857.2024.02.005
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Through silicon via filling technologies in superconducting quantum

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 42(2): 50-57 https://doi.org/10.3981/j.issn.1000-7857.2024.02.005

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